Resin Bond 1A1 Diamond Grinding Wheel Untuk Grinding Tungsten Carbide

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Resin Bond 1A1 Diamond Grinding Wheel Untuk Grinding Tungsten Carbide

Roda intan dan CBN ikatan resin

June 07, 2024

Category Connection: 1A1 Roda Berlian

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Tags:

#30 inci berlian permukaan grinding roda #D126 Roda penggiling berlian #Cylindrical Grinding 1A1 Roda Berlian

Brief: Discover the high-quality Resin Bond 1A1 Diamond Grinding Wheel, perfect for grinding tungsten carbide and other hard materials. Ideal for cylindrical grinding and cutting edge processing, this wheel offers versatility and precision for various applications.

Related Product Features:

Flat resin diamond grinding wheel designed for cylindrical grinding and cutting edge processing.
Suitable for grinding hard and brittle materials like cemented carbide, optical glass, and ceramics.
Available in various concentrations: 50%, 75%, 100%, 125%, and 150%.
Multiple mesh options for coarse, medium, fine grinding, and polishing.
Customizable specification sizes to meet specific grinding needs.
Wide application range including hard alloy, high alumina porcelain, and semiconductor materials.
Durable and efficient for precision grinding tasks.
High-quality resin bond ensures long-lasting performance.

Pertanyaan:

What materials can the Resin Bond 1A1 Diamond Grinding Wheel grind?

It is suitable for grinding hard and brittle materials such as cemented carbide, high alumina porcelain, optical glass, agate gemstone, semiconductor material, ceramics, and stone.
What are the available concentrations for this grinding wheel?

The grinding wheel is available in concentrations of 50%, 75%, 100%, 125%, and 150% to suit different grinding requirements.
Can the specification sizes of the grinding wheel be customized?

Yes, the specification sizes can be customized to meet specific grinding needs and applications.