Name: 1A1 Metal Bond Diamond Grinding Wheel 300mm D91 for Semiconductor Wafer Fine Grinding
Brand: ZHENGZHOU SHINE ABRASIVES CO.,LTD
SKU: 1A1
Price: 50.00 USD
Availability: InStock

Rumah Produk Roda penggiling ikatan logam

1A1 Metal Bond Diamond Grinding Wheel 300mm D91 for Semiconductor Wafer Fine Grinding

Detail produk:

Tempat asal:	Cina
Nama merek:	Shine Abrasives
Sertifikasi:	ISO
Nomor model:	1A1

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order:	2 buah
Harga:	Negotiate
Kemasan rincian:	1 pc dalam satu kotak kertas
Waktu pengiriman:	5 hari kerja
Syarat-syarat pembayaran:	L/C,T/T
Menyediakan kemampuan:	1000 buah per minggu

Kontak

Detil Deskripsi produk

Membentuk:	1A1	Diameter:	300mm
Jenis Obligasi:	Logam	Ukuran grit:	D91
Bahan abrasif:	berlian	Kondisi Kerja:	Penggilingan halus terus menerus, operasi panjang
Aplikasi:	Bahan semikonduktor, keramik, batu, bahan magnet, kaca	Kode HS:	6804211000
Menyoroti:	Metal Bond Diamond Grinding Wheel 300mm , D91 Grinding Wheel for Semiconductor Wafer , Fine Grinding Wheel with Metal Bond

1A1 Metal Bond Diamond Grinding Wheel 300mm D91 The 1A1 metal bond diamond grinding wheel (300mm, D91 grit) is engineered with a metal bond of high bonding strength and superior wear resistance. Strong grit retention enables stable, fine grinding of hard and brittle materials under continuous and mass production conditions. Key Features High bonding strength for secure diamond grit retention Superior wear resistance for long-hour continuous operation Fine D91 grit for smooth,

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Kontak Person: Lenny Li

Tel: 008615003895611

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